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| Thin Aluminum Nitride
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Aluminum Nitride substrates
thinned to 125 microns (0.005") can be the safe
alternative to BeO for high power chips resistors and
critical network applications. Lapped or polished substrate
surfaces with consistent finish are now available from
stock.
Ultra-Thin Aluminum Nitride Lapped Substrates
Tolerances:
· Thickness: ± 0.001"
· Surface: 25 u" Ra
· Thermal Conductivity: 175 W/mk
· Length & Width: ±
0.005" diamond cut |
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L/W |
Thickness |
10 |
25 |
50 |
100 |
|
1"x1" |
0.005" |
CALL |
CALL |
CALL |
CALL |
|
2"x2" |
0.005" |
CALL |
CALL |
CALL |
CALL |
|
3"x3" |
0.005" |
CALL |
CALL |
CALL |
CALL |
|
4"x4" |
0.005" |
CALL |
CALL |
CALL |
CALL |
3¾"x4½" |
0.005" |
CALL |
CALL |
CALL |
CALL |
4½"x4½" |
0.005" |
CALL |
CALL |
CALL |
CALL |
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Note: For tighter tolerances and better surface finish, contact Customer Service.
· Delivery from stock
· Minimum order $300.00
Ultra-Thin Aluminum
Nitride Polished Substrates
Tolerances:
· Thickness: ±
0.001"
· Surface: 1½
u" Ra nominal (2 u" max.)
· Thermal Conductivity:
175 W/mk
· Length & Width:
± 0.005" diamond cut |
|
|
L/W |
Thickness |
10 |
25 |
50 |
100 |
|
1"x1" |
0.005" |
CALL |
CALL |
CALL |
CALL |
|
2"x2" |
0.005" |
CALL |
CALL |
CALL |
CALL |
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3"x3" |
0.005" |
CALL |
CALL |
CALL |
CALL |
|
4"x4" |
0.005" |
CALL |
CALL |
CALL |
CALL |
3¾"x4½" |
0.005" |
CALL |
CALL |
CALL |
CALL |
4½"x4½" |
0.005" |
CALL |
CALL |
CALL |
CALL |
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Note: For tighter tolerances and better surface finish, contact Customer Service.
· Delivery from stock
· Minimum order $490.00
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Updated: 28 September 2008 |
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