Sapphire ultra-thin wafers, substrates and windows
|
Advanced Search Powered by KSearch 1.5b Thin SapphireThe thinnest Sapphire wafers and parts can be made from A-plan [1120] orientation. Thinness of 10 microns (0.0004") has been achieved, but not easily. With R-plane [1102] sapphire orientation, a realistic thickness for wafers and substrates is in the 100 to 125 micron range (0.004 to 0.005"). Size is not a real limitation for thin wafers and substrates. Parts 12½" x 2½" x 0.0035" have been produced in polished Sapphire. Depending on orientation, the best surface finish of a few Angstroms is attainable and for these finishes, measurements are made on WYKO non-contact interferometer. Other Sapphire related services provided include edge-angle polishing, wafer thinning and dicing. Available from stock are A-plane sapphire wafers to thinness of 0.001" (25 microns) and in R-plane sapphire wafers, starting at 0.005" (125 microns). Sapphire wafer and substrate related Web sites:
Updated: 16 Jan 2009 |
|||||||||
|
|
© 2010 Valley Design Corp. All Rights Reserved |