Thin Substrate and Wafer Ultra Sonic Drilling and Coring
Thin Substrate and Wafer Hole Drilling and Coring
Ultra-thin material hole drilling, core drilling and dicing has been a specialty at Valley design for close to 40 years. Drilling and dicing is performed by Valley’s highly skilled personnel using computerized dicing saws, drills and CNC equipment.
Valley offers CNC machining and dicing, rotary ultrasonic diamond and laser drilling of all materials including quartz, ceramics, glass, sapphire, polyimides, stainless steel and many other materials with configurations as small as 1mm x 1mm x 25 microns thick, which could also have a 1/2mm hole. Parts can also be AR coated.
Typical core drilled parts:
Typical hole drilled parts:
Valley Design has extensive experience with these and other similar projects. Many various materials are processed by Valley from hard ceramics and Sapphire, to metals, quartz and glass. Contact us for your hole drilling and core drilling requirements, as well as keep us in mind for any other precision machining including lapping, optical polishing, dicing, backgrinding, slicing and CNC machining.
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Valley Design East
Phoenix Park Business Center
2 Shaker Road, Bldg. E-001
Shirley, MA 01464
Valley Design West
Santa Cruz, CA 95060
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