Thin dice by thinning wafer after dicing:
Thinning dice after dicing has advantages over thinning wafers prior to singulating. Less cracking,
lower stresses, choice of surface finish on backside, and tighter thickness tolerances.
Thinning and polishing Anodic Bonded wafers for MEMS:
Bonded wafers including silicon on silicon, silicon on SiC, silicon on glass, silicon on sapphire,
MEMS, SOI, anodic or any other combination thinned and polished to micron tolerances.
Silicon wafers thinned to produce thinner dice (chips):
Bumped silicon wafers, chips and all other semiconductor material wafers and singulated
die thinned-backlapped to any thickness.
Thinning of silicon and GaAs wafers, substrates and dice:
Polished thin silicon and gallium arsenide wafers from the experts - Valley Design.
Silicon lapping, backlapping and thinning services:
Precision lapping and backlapping of silicon and other semiconductor materials
in prototype and production quantities are offered Valley Design.
Polished optical windows and substrates, also ultra-thin:
Polished optical soda lime glass windows, substrates, wafers and plates are
available from stock as thin as 0.002 in. from Valley Design Corp.
Polished sapphire substrates, ultra thin:
Polished ultra thin sapphire is available in all sizes and thicknesses as substrates, wafers, windows
and dice from Valley Design Corp.
Return to Home Page:
Thin precision glass sheets and precision optics