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Related Pages
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Thin dice by thinning wafer after dicing:
Thinning dice after dicing has advantages over thinning wafers prior to singulating. Less cracking,
lower stresses, choice of surface finish on backside, and tighter thickness tolerances.
www.customdicing.com/thin-dice.htm
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Thinning and polishing Anodic Bonded wafers for MEMS:
Bonded wafers including silicon on silicon, silicon on SiC, silicon on glass, silicon on sapphire,
MEMS, SOI, anodic or any other combination thinned and polished to micron tolerances.
www.siliconwafers.net/cmp-soi.htm
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Silicon wafers thinned to produce thinner dice (chips):
Bumped silicon wafers, chips and all other semiconductor material wafers and singulated
die thinned-backlapped to any thickness.
www.siliconwafers.net/thinned.htm
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Thinning of silicon and GaAs wafers, substrates and dice:
Polished thin silicon and gallium arsenide wafers from the experts - Valley Design.
http://www.valleydesign.com/ultra-thin-silicon.htm
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Silicon lapping, backlapping and thinning services:
Precision lapping and backlapping of silicon and other semiconductor materials
in prototype and production quantities are offered Valley Design.
http://www.valleydesign.com/silicon-lapping-service.htm
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Polished optical windows and substrates, also ultra-thin:
Polished optical soda lime glass windows, substrates, wafers and plates are
available from stock as thin as 0.002 in. from Valley Design Corp.
http://www.valleydesign.com/solime.html
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Polished sapphire substrates, ultra thin:
Polished ultra thin sapphire is available in all sizes and thicknesses as substrates, wafers, windows
and dice from Valley Design Corp.
http://www.valleydesign.com/sapphire.htm
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Thin precision glass sheets and precision optics
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